Bo Lu
Data and place of birth: 04.02.1998, Hubei Province of China
Address: Xianning City, Hubei Province, China
Contact: +8615602454711 / alpha_lb@outlook.com
Education & Experience
2020/08 - 2021/04
HUAWEI TECHNOLOGIES CO., LTD, Wuhan China - Process Integration Engineer
2018/09 - 2020/07
Southern University of Science and Technology - Harbin Institute of Technology (joint program), Department of Electrical and Electronic Engineering, Shenzhen China - Master of Engineering
Major: Optical Engineering
Thesis: FABRICATION AND THERMAL STABILITY OF GAN-BASED MICRO-LED DISPLAY ARRAY
2014/09 - 2018/07
China University of Mining and Technology, School of Physics, Xuzhou China - Bachelor of Science
Major: Opto-Electronics Information Science and Engineering
Thesis: Design of GaN-Based Micro-LED Display System
Publications
Journal Paper
- Color Difference and Thermal Stability of Flexible Transparent InGaN/GaN Multiple Quantum Wells Mini-LED Arrays
B. Lu, Y. Wang, B. Hyun, H. Kuo and Z. Liu
IEEE Electron Device Letters, 41(7), 1040-1043, 2020. 10.1109/LED.2020.2994143
Conference Proceedings
- Temperature‐dependent Forward Voltage of AlGaInP‐based Red Micro‐LEDs
Wang, Y., Lu, B., Liu, C., Kuo, H., Hyun, B. and Liu, Z
SID Symposium Digest of Technical Papers, 51,129-131, 2020. 10.1002/sdtp.13770
- P‐7.4: Thermal Stability Analysis of Micro‐LED arrays
Lu, B., Jiang, F., Xiong, Z., Wang, Y., Wei, F. and Liu, Z
SID Symposium Digest of Technical Papers, 50, 807-809, 2019.10.1002/sdtp.13655
- Investigation of Tempreture-denpendent Behaviors of Micro-LED Displays
Liu, Zhaojun, Lu, Bo, Liu, Minggang et al.
Proceedings of the International Display Workshops. 1473, 2019. 10.36463/idw.2019.1473
Projects (2018-2021)
- Process Integration
1. Develop, design and check the inline (Fabcell) and end of line (ePCM/oPCM) monitor structures of silicon photonics devices by python script.
in full process.
2. Maintain and update design pdk and rules as COT member, help product tape out.
3. Run lots of products at the back end of line (BEOL).
4. Transfer mask design of full device from manual to script.
5. Automatically capture Mask data to standardize it, then build a standard format library with FAB.
- Design of 32 × 32 GaN Mini-LED Display System
The driving circuit (PCB) and display circuit (FPC) designed by Altium Designer were combined with custom made FPGA to demonstrate a Blue Mini-LED display system. Flip-chip technology was used to fabricate 1024 LED chips by transfer bonding each pixel on solder paste precisely.
- Studies of Thermal Stability of Flexible Transparent Mini-LED Array
The studies of the color change and thermal distribution of a flexible and transparent 32×32 mini-LED array on PET substrate up to a brightness rating of 5000 nits at room temperature was presented. The calculated color differences from the EL spectra at three different brightness are far less than the color discrimination threshold of the human eye corresponding to 0.005 at all testing brightness and meet the display industry requirement for color difference.
- Fabrication of GaN/InGaN Micro-LED
The InGaN/GaN epitaxy wafer was covered by photoresist and SiO2 partially, and ICP system was used to etch mesa for n-contact. After removing the SiO2, the Ni/Au was used to spread the current. After the current spread layer, electrodes were made for current injection.
Patents
- Lu Bo, Micro light-emitting diode chip and display panel, China Patent, CN:201921765435: U, 20200505
- Lu Bo, Transfer substrate and system of LED Chips, China Patent, CN201921773581.7, 20200724
Other skills
- Basic programming skills for analysis in Python, Matlab
卢博
出生信息: 1998/02/04, 湖北省咸宁市
居住地址: 湖北省咸宁市
联系方式: Tel-15602454711 / Email-alpha_lb@outlook.com
教育 &工作经历
2020/08 - 2021/04
华为海思光电子有限公司, 武汉 - Process Integration Engineer
2018/09 - 2020/07
南方科技大学(哈尔滨工业大学联合培养), 电子与电气工程系, 深圳 - 工学硕士
专业: 光学工程
毕业论文: 氮化镓基 Micro-LED 显示阵列制备与热稳定性研究
2014/09 - 2018/07
中国矿业大学, 物理学院, 徐州 - 理学学士
专业: 光电信息科学与工程
毕业论文: 氮化镓基 Micro-LED 显示技术系统设计
发表文章
期刊文章
- Color Difference and Thermal Stability of Flexible Transparent InGaN/GaN Multiple Quantum Wells Mini-LED Arrays
B. Lu, Y. Wang, B. Hyun, H. Kuo and Z. Liu
IEEE Electron Device Letters, 41(7), 1040-1043, 2020. 10.1109/LED.2020.2994143
会议文章
- Temperature‐dependent Forward Voltage of AlGaInP‐based Red Micro‐LEDs
Wang, Y., Lu, B., Liu, C., Kuo, H., Hyun, B. and Liu, Z
SID Symposium Digest of Technical Papers, 51,129-131, 2020. 10.1002/sdtp.13770
- P‐7.4: Thermal Stability Analysis of Micro‐LED arrays
Lu, B., Jiang, F., Xiong, Z., Wang, Y., Wei, F. and Liu, Z
SID Symposium Digest of Technical Papers, 50, 807-809, 2019.10.1002/sdtp.13655
- Investigation of Tempreture-denpendent Behaviors of Micro-LED Displays
Liu, Zhaojun, Lu, Bo, Liu, Minggang et al.
Proceedings of the International Display Workshops. 1473, 2019. 10.36463/idw.2019.1473
项目经历 (2018-2021)
- Process Integration
1. 开发，设计并检查硅光器件制造中的在线工艺检测模块和完整器件光电性能检测模块
2. 作为COT成员维护和更新pdk与design rules，帮助实现产品Tape Out
3. 作为PIE负责产品后端工艺顺利进行
4. 将Mask设计代码化，大幅度提高改版效率
5. 自动抓取Mask信息生成标准化数据，并与FAB协商建立标准传输数据库
- 32 × 32柔性透明Mini-LED阵列设计与制造
使用Altium Designer设计Mini-LED 阵列的驱动与显示电路，将制得的PCB，FPC和FPGA组成完整的Mini-LED显示系统。最后将1024颗LED芯片一一倒装在FPC基板上。
- 32 × 32柔性透明Mini-LED阵列热稳定性研究
对32×32柔性透明Mini-LED阵列进行热学分布测试，对不同区域的LED进行光波长分析，研究温度引起的LED波长变化是否对显示效果有影响。结果表明，即使在在室温下显示亮度达到5000nit，电致发光光谱在不同亮度下计算出的色差远小于人眼对应的颜色辨别阈值0.005，满足显示行业对色差的要求。
- GaN/InGaN Micro-LED工艺制造
使用L-edit设计5层掩模版用于光刻步骤，基于GaN/InGaN外延片开始工艺流程，包括光刻，ICP刻蚀，Ebeam蒸镀，磁控溅射。在InGaN/GaN外延片表面图形化覆盖光刻胶和SiO2，使用ICP系统蚀刻外延片暴露出N型台面；去除SiO2后使用Ni/Au作为电流扩散层；最后沉积电极作为用于电流注入。
专利
- 微型发光二极管芯片以及显示面板CN:201921765435:U, 20200505
- LED芯片的转移基板及系统, CN201921773581.7, 20200724
其他